Binder system for micropowder injection molding

Z. Y. Liu; N. H. Loh; S. B. Tor; K. A. Khor; Y. Murakoshi; R. Maeda

doi:10.1016/S0167-577X(00)00276-7

Binder system for micropowder injection molding

Z. Y. Liu
, N. H. Loh
, S. B. Tor
, K. A. Khor
, Y. Murakoshi
, R. Maeda

Nanyang Technological University
National Institute of Advanced Industrial Science and Technology

Research output: Contribution to journal › Article › peer-review

116 Scopus citations

Abstract

To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.% PW+40 wt.% EVA+40 wt.% HDPE binder system.

Original language	English
Pages (from-to)	31-38
Number of pages	8
Journal	Materials Letters
Volume	48
Issue number	1
DOIs	https://doi.org/10.1016/S0167-577X(00)00276-7
State	Published - Mar 2001
Externally published	Yes

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title = "Binder system for micropowder injection molding",

abstract = "To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.\% PW+40 wt.\% EVA+40 wt.\% HDPE binder system.",

author = "Liu, \{Z. Y.\} and Loh, \{N. H.\} and Tor, \{S. B.\} and Khor, \{K. A.\} and Y. Murakoshi and R. Maeda",

year = "2001",

month = mar,

doi = "10.1016/S0167-577X(00)00276-7",

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volume = "48",

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TY - JOUR

T1 - Binder system for micropowder injection molding

AU - Liu, Z. Y.

AU - Loh, N. H.

AU - Tor, S. B.

AU - Khor, K. A.

AU - Murakoshi, Y.

AU - Maeda, R.

PY - 2001/3

Y1 - 2001/3

N2 - To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.% PW+40 wt.% EVA+40 wt.% HDPE binder system.

AB - To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.% PW+40 wt.% EVA+40 wt.% HDPE binder system.

UR - https://www.scopus.com/pages/publications/0034831527

U2 - 10.1016/S0167-577X(00)00276-7

DO - 10.1016/S0167-577X(00)00276-7

M3 - 文章

AN - SCOPUS:0034831527

SN - 0167-577X

VL - 48

SP - 31

EP - 38

JO - Materials Letters

JF - Materials Letters

IS - 1

ER -

Binder system for micropowder injection molding

Abstract

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