Bidirectional interlayer cooling of 3D chip stack for temperature uniformity enhancement and hotspot mitigation

In this work, bidirectional interlayer cooling with both enhanced temperature uniformity and low flow resistance is proposed for effective 3D chip stack thermal management. Staggered uniform micropin fins and curved entrance and exit regions are elaborately designed. Experimental and numerical studies are carried out to investigate the cooling characteristics under different Reynolds numbers and heat fluxes. In comparison with common interlayer cooling solutions, counter-flow arrangement is achieved between the layers and vertical heat transfer within the chip stack is utilized. Heat fluxes of 300 W/cm² and 100 W/cm² are dissipated in the hotspot and background zones respectively. Total thermal resistance of 0.18 K/W is obtained. The maximum decrease in temperature difference is up to 66.2%. Both thermal resistance and coefficient of performance (COP) are considered and compared with the results from previous studies for comprehensive performance evaluation. The maximum COP of 11,523 is reached. The thermal and hydraulic performance advantages of the present design can be verified. The bidirectional interlayer cooling offers new potential for thermal management of 3D chip stack.