Assessing aptitude of plated Ni-W film as mold materials for borosilicate glass

We propose the Ni-W plating film as a mold material for the hot embossing of borosilicate glass. The lifetime of a Ni-W plating mold is important from a practical perspective. However, there have been no previous reports on the life of a mold. Contact angle has been reported as a parameter for the comparative assessment of wettability. In this report, we identified the components of borosilicate glass reacted with a Ni-W film by elemental analysis together with a wettability test. In the wettability test, increasing temperature caused a decrease in of contact angle, which is caused by the chemical reaction at the center of glass. In the results of the elemental analysis of the Ni-W film in contact with glass, Zn, a constituent of the glass, was not detected in the noncontact zone, but was detected in the contact zone. There is no binary alloy phase diagram of W-Zn. It is considered that W does not form an alloy with Zn. Results from the reaction of Zn on Ni indicated an increase in the wettability of borosilicate glass for the Ni-W plating film.