@inproceedings{d8a93b5821a1442c9a2324066df583cd,
title = "Application of Silicon Piezoresistive Effect in Mems Embedded Microlfuidic Cooling",
abstract = "The multi-sensor fusion test vehicle is proposed to evaluate the mechanical properties in embedded microfluidic cooling. According to the principle of silicon piezoresistive effect, thermal/stress test chip (TSTC) and TSV pressure sensors are fabricated. It is successfully demonstrated the implanted pressure sensors improves the accuracy of pressure data. In addition, the thermal stress caused by local hotspot and the mechanical stress caused by coolant impact together lead to uneven stress distribution on the chip surface. The application of silicon piezoresistive units in embedded microfluidic structure can be used as an important methods for cooling performance and reliability analysis evaluation.",
keywords = "Silicon piezoresistive effect, TSV pressure sensor, embedded cooling, thermal/stress test chip",
author = "Yuxin Ye and Shichang Yun and Ruiwen Liu and Wei Li and Zhiqiang Wang and Xiangbin Du and Yanmei Kong and Kunpeng Jia and Nan Zhang and Lihang Yu and Bo Cong and Shiqi Jia and Binbin Jiao and Dapeng Chen",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022 ; Conference date: 09-01-2022 Through 13-01-2022",
year = "2022",
doi = "10.1109/MEMS51670.2022.9699818",
language = "英语",
series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "664--667",
booktitle = "35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022",
}