TY - JOUR
T1 - Anodic Oxidation Shock Volumetric Expansion of Carbon Nanotube in Composite with Graphene and Reinforced Copper
AU - Wang, Gengjie
AU - Chen, Dong
AU - Zhang, Yaoyin
AU - Zhu, Lu
AU - Huang, Zhifu
N1 - Publisher Copyright:
© 2025 American Chemical Society
PY - 2025/11/14
Y1 - 2025/11/14
N2 - A novel method combining anodic oxidation shock and electrodeposition, followed by annealing and rolling, was developed for fabricating dual-continuous carbon nanotube/Cu (CNT/Cu) composites. The anodic oxidation shock treatment induced significant volumetric expansion of CNT films (from 10 μm to ∼4 mm), enlarging interstitial gaps to facilitate Cu2+infiltration during electrodeposition. Simultaneously, this treatment increased surface oxygen content, enhanced hydrophilicity, removed residual Fe catalysts and amorphous carbon, introduced oxygen-containing functional groups, and strengthened Cu-CNT interfacial bonding via electrostatic interactions. Optimization of electrodeposition parameters revealed that a current density of 0.5 A·cm–2achieved the highest Cu content within the CNT network, while an electroplating time of 60 min ensured complete coverage of the CNT film by Cu, reducing the sheet resistance to near-pure Cu levels. Post-treatment further improved the composite density to 96.4% and formed a dual-continuous structure, where both Cu and CNTs maintained continuous networks. The resulting composites exhibit excellent interfacial bonding and structural integrity, making them promising for applications in the electronic and thermal management fields.
AB - A novel method combining anodic oxidation shock and electrodeposition, followed by annealing and rolling, was developed for fabricating dual-continuous carbon nanotube/Cu (CNT/Cu) composites. The anodic oxidation shock treatment induced significant volumetric expansion of CNT films (from 10 μm to ∼4 mm), enlarging interstitial gaps to facilitate Cu2+infiltration during electrodeposition. Simultaneously, this treatment increased surface oxygen content, enhanced hydrophilicity, removed residual Fe catalysts and amorphous carbon, introduced oxygen-containing functional groups, and strengthened Cu-CNT interfacial bonding via electrostatic interactions. Optimization of electrodeposition parameters revealed that a current density of 0.5 A·cm–2achieved the highest Cu content within the CNT network, while an electroplating time of 60 min ensured complete coverage of the CNT film by Cu, reducing the sheet resistance to near-pure Cu levels. Post-treatment further improved the composite density to 96.4% and formed a dual-continuous structure, where both Cu and CNTs maintained continuous networks. The resulting composites exhibit excellent interfacial bonding and structural integrity, making them promising for applications in the electronic and thermal management fields.
KW - anodic oxidation
KW - carbon nanotubes
KW - copper
KW - dual-continuous structured
KW - interface
UR - https://www.scopus.com/pages/publications/105021872626
U2 - 10.1021/acsanm.5c04060
DO - 10.1021/acsanm.5c04060
M3 - 文章
AN - SCOPUS:105021872626
SN - 2574-0970
VL - 8
SP - 21983
EP - 21993
JO - ACS Applied Nano Materials
JF - ACS Applied Nano Materials
IS - 45
ER -