TY - JOUR
T1 - Analytical Modeling of Charge Behavior in Pinned Photodiode for CMOS Image Sensors
AU - Hu, Congzhen
AU - Zhang, Bing
AU - Xin, Youze
AU - Xie, Yiyun
AU - Hu, Pengfei
AU - Geng, Li
N1 - Publisher Copyright:
© 2001-2012 IEEE.
PY - 2023/7/1
Y1 - 2023/7/1
N2 - The thermionic emission mechanism is usually employed to model the charge packet, which is not affected by the potential barrier; however, the electric fields induced by the charge itself are not included in the previous work. We introduce a proposed physical-based model to characterize the whole charge behavior characteristics of the pinned photodiode (PPD) when employing the thermal diffusion, self-induced drifting, and thermionic emission mechanisms together. In addition, the dynamic PPD parameters such as PPD capacitance (CPPD) , PPD potential (VPPD), and charge transfer potential barrier (VB) are included to characterize the integration and transfer process together based on iterative methods. The model is verified with technology computer-aided design (TCAD) simulations, and the test devices were fabricated in a 0.11-μm CMOS image sensor (CIS) process. The proposed analytical behavior model presents a great convenience for circuit-level simulation of the PPD-based pixels.
AB - The thermionic emission mechanism is usually employed to model the charge packet, which is not affected by the potential barrier; however, the electric fields induced by the charge itself are not included in the previous work. We introduce a proposed physical-based model to characterize the whole charge behavior characteristics of the pinned photodiode (PPD) when employing the thermal diffusion, self-induced drifting, and thermionic emission mechanisms together. In addition, the dynamic PPD parameters such as PPD capacitance (CPPD) , PPD potential (VPPD), and charge transfer potential barrier (VB) are included to characterize the integration and transfer process together based on iterative methods. The model is verified with technology computer-aided design (TCAD) simulations, and the test devices were fabricated in a 0.11-μm CMOS image sensor (CIS) process. The proposed analytical behavior model presents a great convenience for circuit-level simulation of the PPD-based pixels.
KW - Analytical modeling
KW - CMOS image sensors (CISs)
KW - pinned photodiode (PPD)
KW - self-induced drifting
KW - thermal diffusion
KW - thermionic emission
UR - https://www.scopus.com/pages/publications/85161070139
U2 - 10.1109/JSEN.2023.3278307
DO - 10.1109/JSEN.2023.3278307
M3 - 文章
AN - SCOPUS:85161070139
SN - 1530-437X
VL - 23
SP - 14295
EP - 14303
JO - IEEE Sensors Journal
JF - IEEE Sensors Journal
IS - 13
ER -