TY - JOUR
T1 - Analysis of the interruption process of molded case circuit breakers
AU - Li, Xingwen
AU - Chen, Degui
AU - Wang, Yunfeng
AU - Wang, Qian
AU - Geng, Yingsan
PY - 2007
Y1 - 2007
N2 - To the optimization design of molded case circuit breakers (MCCBs), it is important and necessary to simulate the interruption process and analyze the characteristics. A set of differential equations can describe the interactive coupled phenomena of electric circuit, electromagnetic field and mechanism motion system in MCCB. First, with virtual prototyping technology, the simulation model for the operation mechanism of MCCB can be built, and experiments have been carried out to verify its validity. Then, with the existence of electrodynamic repulsion force, the interruption process of the MCCB has been investigated with the influence of arc voltage, closing phase angle, prospective current, mechanism starting motion time and blow open force. It demonstrates the proposed method is effective and is capable of evaluating the new design of MCCB products.
AB - To the optimization design of molded case circuit breakers (MCCBs), it is important and necessary to simulate the interruption process and analyze the characteristics. A set of differential equations can describe the interactive coupled phenomena of electric circuit, electromagnetic field and mechanism motion system in MCCB. First, with virtual prototyping technology, the simulation model for the operation mechanism of MCCB can be built, and experiments have been carried out to verify its validity. Then, with the existence of electrodynamic repulsion force, the interruption process of the MCCB has been investigated with the influence of arc voltage, closing phase angle, prospective current, mechanism starting motion time and blow open force. It demonstrates the proposed method is effective and is capable of evaluating the new design of MCCB products.
KW - Blow open force
KW - Circuit breaker
KW - Interruption process
KW - Repulsion force
KW - Virtual prototyping technology
UR - https://www.scopus.com/pages/publications/65449148668
U2 - 10.1109/TCAPT.2007.900051
DO - 10.1109/TCAPT.2007.900051
M3 - 文章
AN - SCOPUS:65449148668
SN - 1521-3331
VL - 30
SP - 375
EP - 382
JO - IEEE Transactions on Components and Packaging Technologies
JF - IEEE Transactions on Components and Packaging Technologies
IS - 3
ER -