Skip to main navigation Skip to search Skip to main content

An Integrated GaN-Based Converter Based on Cooling-System-Inductor Structure for point-of-load converters

  • Longyang Yu
  • , Wei Mu
  • , Huaqing Li
  • , Chengzi Yang
  • , Chenya Wang
  • , Laili Wang
  • Xi'an Jiaotong University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

The paper proposes an integrated GaN-based power converter, which has these features of a 3-D integrated magnetic component with alloy materials, improving the power density. Besides, the 3-D integrated magnetic component with alloy materials has high thermal conductivity, which can be regarded as a heat sink for an integrated GaN-based power module and further increase the power density. A comprehensive analysis of the thermal and parasitic characteristics of the GaN-based power converter, and the characteristics and design of 3-D integrated magnetic component with heat sink function by finite element software are discussed in detail. Two 90 W, 12-1.8 V, experimental prototype of four-phase interleaving POL converter based ferrite materials and alloy materials on are built and tested, respectively. The experimental results demonstrate that GaN-based power module based on 3-D integrated magnetic component with alloy materials has low parasitic parameters, good thermal performance, high efficiency and high power density than that of ferrite materials.

Original languageEnglish
Title of host publicationIEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages236-240
Number of pages5
ISBN (Electronic)9781665418515
DOIs
StatePublished - 2021
Event2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2021 - Wuhan, China
Duration: 25 Aug 202127 Aug 2021

Publication series

NameIEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2021

Conference

Conference2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2021
Country/TerritoryChina
CityWuhan
Period25/08/2127/08/21

Keywords

  • 3-D integrated magnetic component
  • GaN-based power module
  • heat sink

Fingerprint

Dive into the research topics of 'An Integrated GaN-Based Converter Based on Cooling-System-Inductor Structure for point-of-load converters'. Together they form a unique fingerprint.

Cite this