An in situ fabrication of CuGa₂film on copper surface with improved Tribological properties

Interface interaction between gallium-based liquid metal and copper-based materials results in the formation of intermetallic CuGa2 grains. In particular, CuGa2 grains are able to produce a uniform film and the newly formed CuGa2 film holds peculiar characteristics, which have not been fully explored up to now. In this study, we present an electrochemical fabrication method of an in situ CuGa2 film on copper surface. Surface morphology and chemical composition of this film are confirmed. Tribological experiments demonstrate that the CuGa2 film enables good antifriction and antiwear abilities. Furthermore, the lubrication mechanisms of the CuGa2 film are revealed.