An experimental study of a novel integrated heat pipe-heat sink for chip cooling

To increase thermal performance of a heat pipe-heat sink for chip cooling, a novel integrated heat pipe-heat sink is presented, whose condenser's fins outside cooling surface is about 0.38 m². The time response, pressure drop and heat transfer characteristics of the integrated heat pipe-heat sink were investigated by experiment. Results show that the integrated heat pipe heat sink has high effective heat transfer performance. With the airflow velocity 2.93 m/s and maximum temperature difference restrict 50°C, the heat sink can dissipate 423 W and the corresponding thermal resistance is only 0.118 K/W, while the pressure drop through the heat sink is just 30 Pa.