Advances in polymers and composite dielectrics for thermal transport and high-temperature applications

Liangliang Wang; Chenxi Yang; Xinyue Wang; Jiayi Shen; Wenjie Sun; Jinkai Wang; Ganqiu Yang; Yonghong Cheng; Zhengdong Wang

doi:10.1016/j.compositesa.2022.107320

Advances in polymers and composite dielectrics for thermal transport and high-temperature applications

Liangliang Wang
, Chenxi Yang
, Xinyue Wang
, Jiayi Shen
, Wenjie Sun
, Jinkai Wang
, Ganqiu Yang
, Yonghong Cheng
, Zhengdong Wang

School of Electrical Engineering

Xi'an University of Architecture and Technology
Xi'an Jiaotong University

Research output: Contribution to journal › Review article › peer-review

72 Scopus citations

Abstract

Thermal transport performance of polymers and polymer composites has been widely studied as electrical insulating encapsulations for the many applications in microelectronics, power electronic devices, and high voltage power equipment. In fact, high-temperature stability for insulating materials is also an essential parameter for some certain fields such as high-power insulated gate bipolar translator (IGBT) etc. This paper reviews the mechanism, influencing factors and major methods to enhance thermal conductivity of polymers and polymer composites based on two different polymer types (including thermoplastics and thermosetting), due to their different application scenarios and heat-resistant temperature. At the same time, the advantages of these methods, as well as the existing problems and limitations for practical application are comprehensively summarized. In addition, major challenges and opportunities for further developments are also discussed.

Original language	English
Article number	107320
Journal	Composites Part A: Applied Science and Manufacturing
Volume	164
DOIs	https://doi.org/10.1016/j.compositesa.2022.107320
State	Published - Jan 2023

Keywords

Polymer composites
Polymers
Thermal conductivity
Thermal-resistant temperature

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10.1016/j.compositesa.2022.107320

Cite this

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title = "Advances in polymers and composite dielectrics for thermal transport and high-temperature applications",

abstract = "Thermal transport performance of polymers and polymer composites has been widely studied as electrical insulating encapsulations for the many applications in microelectronics, power electronic devices, and high voltage power equipment. In fact, high-temperature stability for insulating materials is also an essential parameter for some certain fields such as high-power insulated gate bipolar translator (IGBT) etc. This paper reviews the mechanism, influencing factors and major methods to enhance thermal conductivity of polymers and polymer composites based on two different polymer types (including thermoplastics and thermosetting), due to their different application scenarios and heat-resistant temperature. At the same time, the advantages of these methods, as well as the existing problems and limitations for practical application are comprehensively summarized. In addition, major challenges and opportunities for further developments are also discussed.",

keywords = "Polymer composites, Polymers, Thermal conductivity, Thermal-resistant temperature",

author = "Liangliang Wang and Chenxi Yang and Xinyue Wang and Jiayi Shen and Wenjie Sun and Jinkai Wang and Ganqiu Yang and Yonghong Cheng and Zhengdong Wang",

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doi = "10.1016/j.compositesa.2022.107320",

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T1 - Advances in polymers and composite dielectrics for thermal transport and high-temperature applications

AU - Wang, Liangliang

AU - Yang, Chenxi

AU - Wang, Xinyue

AU - Shen, Jiayi

AU - Sun, Wenjie

AU - Wang, Jinkai

AU - Yang, Ganqiu

AU - Cheng, Yonghong

AU - Wang, Zhengdong

PY - 2023/1

Y1 - 2023/1

N2 - Thermal transport performance of polymers and polymer composites has been widely studied as electrical insulating encapsulations for the many applications in microelectronics, power electronic devices, and high voltage power equipment. In fact, high-temperature stability for insulating materials is also an essential parameter for some certain fields such as high-power insulated gate bipolar translator (IGBT) etc. This paper reviews the mechanism, influencing factors and major methods to enhance thermal conductivity of polymers and polymer composites based on two different polymer types (including thermoplastics and thermosetting), due to their different application scenarios and heat-resistant temperature. At the same time, the advantages of these methods, as well as the existing problems and limitations for practical application are comprehensively summarized. In addition, major challenges and opportunities for further developments are also discussed.

AB - Thermal transport performance of polymers and polymer composites has been widely studied as electrical insulating encapsulations for the many applications in microelectronics, power electronic devices, and high voltage power equipment. In fact, high-temperature stability for insulating materials is also an essential parameter for some certain fields such as high-power insulated gate bipolar translator (IGBT) etc. This paper reviews the mechanism, influencing factors and major methods to enhance thermal conductivity of polymers and polymer composites based on two different polymer types (including thermoplastics and thermosetting), due to their different application scenarios and heat-resistant temperature. At the same time, the advantages of these methods, as well as the existing problems and limitations for practical application are comprehensively summarized. In addition, major challenges and opportunities for further developments are also discussed.

KW - Polymer composites

KW - Polymers

KW - Thermal conductivity

KW - Thermal-resistant temperature

UR - https://www.scopus.com/pages/publications/85142154297

U2 - 10.1016/j.compositesa.2022.107320

DO - 10.1016/j.compositesa.2022.107320

M3 - 文献综述

AN - SCOPUS:85142154297

SN - 1359-835X

VL - 164

JO - Composites Part A: Applied Science and Manufacturing

JF - Composites Part A: Applied Science and Manufacturing

M1 - 107320

ER -

Advances in polymers and composite dielectrics for thermal transport and high-temperature applications

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Keywords

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