Advances in Infrasound Sensing Technology From Conventional Sensors to MEMS: A Review

Tao Dong; Yu Zhou; Nuno Miguel Matos Pires; Wenyu Mou; Zunyi Lv; Zhaochu Yang; Danilo Demarchi; Zhongyuan Shi; Libo Zhao; Zhuangde Jiang; Qi Mao; Yangtao Wang; Fuyu Tao

doi:10.1109/JSEN.2025.3570712

Advances in Infrasound Sensing Technology From Conventional Sensors to MEMS: A Review

Tao Dong
, Yu Zhou
, Nuno Miguel Matos Pires
, Wenyu Mou
, Zunyi Lv
, Zhaochu Yang
, Danilo Demarchi
, Zhongyuan Shi
, Libo Zhao
, Zhuangde Jiang
, Qi Mao
, Yangtao Wang
, Fuyu Tao

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

This review highlights the progress of infrasound sensing technologies (ISTs), emphasizing the transition from traditional sensors to modern microelectromechanical system (MEMS) sensors. Advancements in sensitivity, dynamic range, and miniaturization are analyzed alongside their implications for geophysics, atmospheric science, and industrial safety applications. By comparing various sensing technologies, this work provides insights into their strengths and limitations, guiding the selection of optimal solutions for infrasonic monitoring applications. The analysis concludes that MEMS sensors offer an optimal balance of sensitivity, dynamic range, integration, miniaturization, and power efficiency. This review further explores the potential applications of MEMS infrasound sensors combined to the Internet of Things and artificial intelligence (AI), aiming to expand the applicability of ISTs across diverse fields.

Original language	English
Pages (from-to)	27878-27897
Number of pages	20
Journal	IEEE Sensors Journal
Volume	25
Issue number	15
DOIs	https://doi.org/10.1109/JSEN.2025.3570712
State	Published - 2025

Keywords

Acoustics
infrasound sensing
microelectromechanical systems (MEMS)
sensors

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10.1109/JSEN.2025.3570712

Cite this

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title = "Advances in Infrasound Sensing Technology From Conventional Sensors to MEMS: A Review",

abstract = "This review highlights the progress of infrasound sensing technologies (ISTs), emphasizing the transition from traditional sensors to modern microelectromechanical system (MEMS) sensors. Advancements in sensitivity, dynamic range, and miniaturization are analyzed alongside their implications for geophysics, atmospheric science, and industrial safety applications. By comparing various sensing technologies, this work provides insights into their strengths and limitations, guiding the selection of optimal solutions for infrasonic monitoring applications. The analysis concludes that MEMS sensors offer an optimal balance of sensitivity, dynamic range, integration, miniaturization, and power efficiency. This review further explores the potential applications of MEMS infrasound sensors combined to the Internet of Things and artificial intelligence (AI), aiming to expand the applicability of ISTs across diverse fields.",

keywords = "Acoustics, infrasound sensing, microelectromechanical systems (MEMS), sensors",

author = "Tao Dong and Yu Zhou and \{Miguel Matos Pires\}, Nuno and Wenyu Mou and Zunyi Lv and Zhaochu Yang and Danilo Demarchi and Zhongyuan Shi and Libo Zhao and Zhuangde Jiang and Qi Mao and Yangtao Wang and Fuyu Tao",

year = "2025",

doi = "10.1109/JSEN.2025.3570712",

language = "英语",

volume = "25",

pages = "27878--27897",

journal = "IEEE Sensors Journal",

issn = "1530-437X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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TY - JOUR

T1 - Advances in Infrasound Sensing Technology From Conventional Sensors to MEMS

T2 - A Review

AU - Dong, Tao

AU - Zhou, Yu

AU - Miguel Matos Pires, Nuno

AU - Mou, Wenyu

AU - Lv, Zunyi

AU - Yang, Zhaochu

AU - Demarchi, Danilo

AU - Shi, Zhongyuan

AU - Zhao, Libo

AU - Jiang, Zhuangde

AU - Mao, Qi

AU - Wang, Yangtao

AU - Tao, Fuyu

PY - 2025

Y1 - 2025

N2 - This review highlights the progress of infrasound sensing technologies (ISTs), emphasizing the transition from traditional sensors to modern microelectromechanical system (MEMS) sensors. Advancements in sensitivity, dynamic range, and miniaturization are analyzed alongside their implications for geophysics, atmospheric science, and industrial safety applications. By comparing various sensing technologies, this work provides insights into their strengths and limitations, guiding the selection of optimal solutions for infrasonic monitoring applications. The analysis concludes that MEMS sensors offer an optimal balance of sensitivity, dynamic range, integration, miniaturization, and power efficiency. This review further explores the potential applications of MEMS infrasound sensors combined to the Internet of Things and artificial intelligence (AI), aiming to expand the applicability of ISTs across diverse fields.

AB - This review highlights the progress of infrasound sensing technologies (ISTs), emphasizing the transition from traditional sensors to modern microelectromechanical system (MEMS) sensors. Advancements in sensitivity, dynamic range, and miniaturization are analyzed alongside their implications for geophysics, atmospheric science, and industrial safety applications. By comparing various sensing technologies, this work provides insights into their strengths and limitations, guiding the selection of optimal solutions for infrasonic monitoring applications. The analysis concludes that MEMS sensors offer an optimal balance of sensitivity, dynamic range, integration, miniaturization, and power efficiency. This review further explores the potential applications of MEMS infrasound sensors combined to the Internet of Things and artificial intelligence (AI), aiming to expand the applicability of ISTs across diverse fields.

KW - Acoustics

KW - infrasound sensing

KW - microelectromechanical systems (MEMS)

KW - sensors

UR - https://www.scopus.com/pages/publications/105007673427

U2 - 10.1109/JSEN.2025.3570712

DO - 10.1109/JSEN.2025.3570712

M3 - 文章

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SP - 27878

EP - 27897

JO - IEEE Sensors Journal

JF - IEEE Sensors Journal

IS - 15

ER -

Advances in Infrasound Sensing Technology From Conventional Sensors to MEMS: A Review

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Keywords

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