@inproceedings{3847925cff9f433baa14b79216b936de,
title = "A study on thermal conductivity and flow of copper-argon nanofluids in microchannel",
abstract = "The outstanding performance on thermal transport of nanofluids makes it possible to replace the traditional heat transfer working medium in micro heat pipes with nanofluids. The flow and heat transfer properties of copper-argon nanofluid under different number of nanoparticles were investigated. The results show that the thermal conductivity of nanofluid in the microchannel is anisotropic. In details, the thermal conductivity of the flow direction (parallel to the wall) is much higher than that of the direction perpendicular to the wall. In terms of flow characteristics, the number density of the base fluid atom near the wall is about 1.7-2 times larger than the average number density, and the velocity of the base fluid near the wall is smaller than the average velocity. What's more, there exists a thin liquid layer near the wall (the thickness is about 3.66×10-10 m).",
keywords = "Molecular dynamics, Nanofluids, Thermal conductivity",
author = "Lei Chen and Kun Wang and Wang, \{Shan You\} and Nie, \{Yi Nan\} and Tang, \{Gui Hua\} and Tao, \{Wen Quan\}",
note = "Publisher Copyright: {\textcopyright} 2018 Begell House Inc.. All rights reserved.; 3rd Thermal and Fluid Engineering Summer Conference, TFESC 2018 ; Conference date: 04-03-2018 Through 07-03-2018",
year = "2018",
doi = "10.1615/TFEC2018.mnh.022044",
language = "英语",
series = "Proceedings of the Thermal and Fluids Engineering Summer Conference",
publisher = "Begell House Inc.",
pages = "1609--1616",
booktitle = "Proceedings of the 3rd Thermal and Fluid Engineering Summer Conference, TFESC 2018",
}
