Abstract
In this paper, the influence of UV irradiation on surface properties of soluble block copolymer polyimide (SBC-PI) was investigated. The changes of topological and chemical properties of SBC-PI were investigated through water droplets test, dynamic force microscope (DFM) measurement, and X-ray photoelectron spectroscopy (XPS) analysis. Analysis results revealed that the surface properties of UV-irradiated SBC-PI film were changes from hydrophobic to hydrophilic without the increase of surface roughness, as a result from the generation of hydrophilic group. Through subsequent Cu electroless plating on selectively modified SBC-PI film, it was also demonstrated that the amount of electroplated Cu could be controlled by varying UV irradiation dose.
| Original language | English |
|---|---|
| Pages (from-to) | 297-302 |
| Number of pages | 6 |
| Journal | Journal of Photopolymer Science and Technology |
| Volume | 26 |
| Issue number | 3 |
| DOIs | |
| State | Published - 2013 |
| Externally published | Yes |
Keywords
- Electroless copper plating
- Polyimide
- Surface modification
- UV irradiation
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