@inproceedings{07b389e456584994babcfe21b86065b6,
title = "A study of mechanical properties and material removal of polycrystalline tungsten via nanoindentation and nanoscratch",
abstract = "Tungsten based products are extensively used in engineering practices. However, there exist some controversies in deformation behaviour between polycrystalline tungsten and its bulk counterpart. In this work, elastic modulus, hardness and removal characteristics of polycrystalline tungsten (poly-W) were investigated by use of nanoindentation and nanoscratch. Atomic Force microscopy (AFM) and Scanning Electron Microscopy (SEM) were employed to characterize the surfaces prior to and after indenting/scratching. The elastic modulus and hardness of the poly-W obtained were 323.6 and 7.1 GPa, respectively. Elastic recovery was barely observed in poly-W after indenting and scratching, indicating that the material was dominantly deformed in plastic regime. The plastic deformation of the poly-W was found to be somehow different from the bulk W, but similar to that of single crystal W nanowhiskers. In multi-scratch test, the pitch distance and scratching speed demonstrated to affect the roughness of the scratched surfaces.",
keywords = "Indentation, Mechanical property, Removal, Scratch, Tungsten",
author = "Kang, \{Cheng Wei\} and Han Huang",
year = "2013",
doi = "10.4028/www.scientific.net/AMR.797.706",
language = "英语",
isbn = "9783037858257",
series = "Advanced Materials Research",
pages = "706--710",
booktitle = "Advances in Abrasive Technology XVI",
note = "16th International Symposium on Advances in Abrasive Technology, ISAAT 2013 and 17th Chinese Conference of Abrasive Technology, CCAT 2013 ; Conference date: 23-09-2013 Through 26-09-2013",
}