Abstract
This paper highlights the interfacial structure of tin-silver (Sn-3.5 Ag) solder on nickel-coated copper pads during aging performance studies at a temperature of 150°C for up to 96 h. Experimental results revealed the as-solidified solder bump made from using the lead-free solder (Sn-3.5Ag) exhibited or showed a thin layer of the tin-nickel-copper intermetallic compound (IMC) at the solder/substrate interface. This includes a sub-layer having a planar structure immediately adjacent to the Ni-coating and a blocky structure on the inside of the solder. Aging performance studies revealed the thickness of both the IMC layer and the sub-layer, having a planar structure, to increase with an increase in aging time. The observed increase was essentially non-linear. Fine microscopic cracks were observed to occur at the interfaces of the planar sub-layer and the block sub-layer.
| Original language | English |
|---|---|
| Pages (from-to) | 251-259 |
| Number of pages | 9 |
| Journal | Sadhana - Academy Proceedings in Engineering Sciences |
| Volume | 33 |
| Issue number | 3 |
| DOIs | |
| State | Published - Jun 2008 |
Keywords
- Electronic packaging
- Interconnections
- Printed circuit board
- Solder bumps
- Thermal aging performance
Fingerprint
Dive into the research topics of 'A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver