A Single-input Dual-output Three-level Buck Converter for SoC Applications

  • Zhuoneng Li
  • , Zhonamina Xue
  • , Chenalona Liang
  • , Yongchao Zhang
  • , Mengqi Duan
  • , Shangzhou Zhao
  • , Xihao Liu
  • , Zhuoqi Guo
  • , Li Geng

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

This paper proposes a single-input dual-output (SIDO) three-level buck converter to meet the requirements of multi-voltage domain and high voltage stress for SoC applications. The topology is based on three-level buck with standard 1.8V devices, where only an additional power switch is added. By using this structure, the second output can be powered by a fly capacitor, and VCF calibration is achieved by the control loop for reliability issues. Hence the efficiency and the power density are enhanced with standard devices and reducing the number of power switches. Moreover, the control loop with error processor and driver module is demonstrated based on the topology analysis. Ultimately, the proposed converter is designed and fabricated with 0.18μm CMOS process, which handles the input range of 3.3-2.8V and dual-output of 1.8V and 1.2V with 96.9% peak efficiency. The power density is 2.557W/mm2, and the active area is only 0.49 mm2.

Original languageEnglish
Title of host publicationProceedings of 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages127-128
Number of pages2
ISBN (Electronic)9781665492690
DOIs
StatePublished - 2022
Event2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022 - Xi'an, China
Duration: 28 Oct 202230 Oct 2022

Publication series

NameProceedings of 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022

Conference

Conference2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022
Country/TerritoryChina
CityXi'an
Period28/10/2230/10/22

Keywords

  • SIDO three-level buck
  • SoC applications
  • error processor
  • high efficiency
  • high power density

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