A simple model for the study of the tolerance of interfacial crack under thermal load

Thermal stresses due to a mismatch between material properties may induce failure of a bonded interface. A simple model for linear dissimilar elastic bonded solids containing an interfacial Zener-Stroh crack under a uniform temperature shift is proposed. Its solution is derived. This result may provide some information about the interface defect tolerant size, which is mainly responsible for triggering interface failures under thermal load. Thus, it can be used to assess the interface integrity and reliability under thermal load. On the other hand, the practical interface crack problem in this study provides another background (mechanism) for the Zener-Stroh crack model.