A research on stress and demolding temperature during hot embossing process of microlens array

Yiqing Wang; Qing Zhang; Daiwei Gan; Xinbin Kuang; Yucheng Ding; Feng Chen; Hongzhong Liu

doi:10.7652/xjtuxb201304002

A research on stress and demolding temperature during hot embossing process of microlens array

Yiqing Wang
, Qing Zhang
, Daiwei Gan
, Xinbin Kuang
, Yucheng Ding
, Feng Chen
, Hongzhong Liu

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

The embossing stress and demolding temperature in the manufacturing process of the gapless hexagonal microlens array by hot embossing process are studied for large-scale manufacturing. The stress change of polymethylmethacrylate (PMMA) in the gapless hexagonal microlens array embossing process is simulated by finite element method. Influencing factors of adhesion strength between mold and PMMA are analyzed. The analysis results show that the normal stress decreases and reaches the lowest level at last when the demolding temperature reduces. The adhesion strength declines as the demolding temperature decreases. When the demolding temperature drops to 20°C, the height fidelity of embossing specimen reaches 94.7%, and embossing defects are eliminated in a large scale.

Original language	English
Pages (from-to)	6-10
Number of pages	5
Journal	Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University
Volume	47
Issue number	4
DOIs	https://doi.org/10.7652/xjtuxb201304002
State	Published - Apr 2013

Keywords

Adhesion strength
Hot embossing
Microlens array
Stress

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10.7652/xjtuxb201304002

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title = "A research on stress and demolding temperature during hot embossing process of microlens array",

abstract = "The embossing stress and demolding temperature in the manufacturing process of the gapless hexagonal microlens array by hot embossing process are studied for large-scale manufacturing. The stress change of polymethylmethacrylate (PMMA) in the gapless hexagonal microlens array embossing process is simulated by finite element method. Influencing factors of adhesion strength between mold and PMMA are analyzed. The analysis results show that the normal stress decreases and reaches the lowest level at last when the demolding temperature reduces. The adhesion strength declines as the demolding temperature decreases. When the demolding temperature drops to 20°C, the height fidelity of embossing specimen reaches 94.7\%, and embossing defects are eliminated in a large scale.",

keywords = "Adhesion strength, Hot embossing, Microlens array, Stress",

author = "Yiqing Wang and Qing Zhang and Daiwei Gan and Xinbin Kuang and Yucheng Ding and Feng Chen and Hongzhong Liu",

year = "2013",

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doi = "10.7652/xjtuxb201304002",

language = "英语",

volume = "47",

pages = "6--10",

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publisher = "Xi'an Jiaotong University",

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TY - JOUR

T1 - A research on stress and demolding temperature during hot embossing process of microlens array

AU - Wang, Yiqing

AU - Zhang, Qing

AU - Gan, Daiwei

AU - Kuang, Xinbin

AU - Ding, Yucheng

AU - Chen, Feng

AU - Liu, Hongzhong

PY - 2013/4

Y1 - 2013/4

N2 - The embossing stress and demolding temperature in the manufacturing process of the gapless hexagonal microlens array by hot embossing process are studied for large-scale manufacturing. The stress change of polymethylmethacrylate (PMMA) in the gapless hexagonal microlens array embossing process is simulated by finite element method. Influencing factors of adhesion strength between mold and PMMA are analyzed. The analysis results show that the normal stress decreases and reaches the lowest level at last when the demolding temperature reduces. The adhesion strength declines as the demolding temperature decreases. When the demolding temperature drops to 20°C, the height fidelity of embossing specimen reaches 94.7%, and embossing defects are eliminated in a large scale.

AB - The embossing stress and demolding temperature in the manufacturing process of the gapless hexagonal microlens array by hot embossing process are studied for large-scale manufacturing. The stress change of polymethylmethacrylate (PMMA) in the gapless hexagonal microlens array embossing process is simulated by finite element method. Influencing factors of adhesion strength between mold and PMMA are analyzed. The analysis results show that the normal stress decreases and reaches the lowest level at last when the demolding temperature reduces. The adhesion strength declines as the demolding temperature decreases. When the demolding temperature drops to 20°C, the height fidelity of embossing specimen reaches 94.7%, and embossing defects are eliminated in a large scale.

KW - Adhesion strength

KW - Hot embossing

KW - Microlens array

KW - Stress

UR - https://www.scopus.com/pages/publications/84876805405

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DO - 10.7652/xjtuxb201304002

M3 - 文章

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SN - 0253-987X

VL - 47

SP - 6

EP - 10

JO - Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University

JF - Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University

IS - 4

ER -

A research on stress and demolding temperature during hot embossing process of microlens array

Abstract

Keywords

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