A novel piezoresistive sensitive structure for micromachined high-pressure sensors

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

A novel piezoresistive sensitive structure for micromachined high-pressure sensors is proposed. This structure employs several small cavities in a silicon bulk. When high pressure applied on all faces of the bulk, stress emerges between two cavities. The calculation for the variation of the resistance caused by stress in three-dimensional (3D) structure was discussed. According to 3D piezoresistive effect, the performance of the sensitivity and nonlinearity affected by the dimensions of cavity structure had been clarified. The simulation results show the optimized position for the resistance is in lower region. This sensitive structure is suitable for micromachined high-pressure sensors and the performance study set a guideline for designing micromachined high-pressure sensors with multi-cavities working in different range.

Original languageEnglish
Title of host publication2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages728-731
Number of pages4
ISBN (Electronic)9781509030590
DOIs
StatePublished - 25 Aug 2017
Event12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, United States
Duration: 9 Apr 201712 Apr 2017

Publication series

Name2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

Conference

Conference12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Country/TerritoryUnited States
CityLos Angeles
Period9/04/1712/04/17

Keywords

  • 3D piezoresistive effect
  • micromachined high pressure
  • piezoresistive sensitive structure
  • resistance arrangement

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