A novel equivalent circuit thermal model for integrated power modules

Wenbo Liu; Yan Fei Liu; Laili Wang; Doug Malcolm

doi:10.1109/APEC.2017.7931141

A novel equivalent circuit thermal model for integrated power modules

Wenbo Liu
, Yan Fei Liu
, Laili Wang
, Doug Malcolm

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

This paper proposes a new analytical thermal resistance model which provides a specific temperature estimation for integrated power modules. Unlike the conventional two-resistor compact model, two case nodes are introduced into the proposed model to reflect the temperatures of junction and inductor. Multiple heat sources are also included in the model. FEA simulation is applied to evaluate the thermal model and verify that the accuracy of junction temperature estimation is significantly improved. It is noted that reducing thermal resistance between the junction and IC top case node can significantly enhance the cooling performance, which enables flexible methods to modify the thermal performance.

Original language	English
Title of host publication	2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	3106-3113
Number of pages	8
ISBN (Electronic)	9781509053667
DOIs	https://doi.org/10.1109/APEC.2017.7931141
State	Published - 17 May 2017
Externally published	Yes
Event	32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 - Tampa, United States Duration: 26 Mar 2017 → 30 Mar 2017

Publication series

Name	Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Conference

Conference	32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Country/Territory	United States
City	Tampa
Period	26/03/17 → 30/03/17

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10.1109/APEC.2017.7931141

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Liu, W., Liu, Y. F., Wang, L., & Malcolm, D. (2017). A novel equivalent circuit thermal model for integrated power modules. In 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017 (pp. 3106-3113). Article 7931141 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEC.2017.7931141

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title = "A novel equivalent circuit thermal model for integrated power modules",

abstract = "This paper proposes a new analytical thermal resistance model which provides a specific temperature estimation for integrated power modules. Unlike the conventional two-resistor compact model, two case nodes are introduced into the proposed model to reflect the temperatures of junction and inductor. Multiple heat sources are also included in the model. FEA simulation is applied to evaluate the thermal model and verify that the accuracy of junction temperature estimation is significantly improved. It is noted that reducing thermal resistance between the junction and IC top case node can significantly enhance the cooling performance, which enables flexible methods to modify the thermal performance.",

author = "Wenbo Liu and Liu, \{Yan Fei\} and Laili Wang and Doug Malcolm",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 ; Conference date: 26-03-2017 Through 30-03-2017",

year = "2017",

month = may,

day = "17",

doi = "10.1109/APEC.2017.7931141",

language = "英语",

series = "Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Liu, W, Liu, YF, Wang, L & Malcolm, D 2017, A novel equivalent circuit thermal model for integrated power modules. in 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017., 7931141, Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, Institute of Electrical and Electronics Engineers Inc., pp. 3106-3113, 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017, Tampa, United States, 26/03/17. https://doi.org/10.1109/APEC.2017.7931141

A novel equivalent circuit thermal model for integrated power modules. / Liu, Wenbo; Liu, Yan Fei; Wang, Laili et al.
2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 3106-3113 7931141 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Liu, Yan Fei

AU - Wang, Laili

AU - Malcolm, Doug

PY - 2017/5/17

Y1 - 2017/5/17

N2 - This paper proposes a new analytical thermal resistance model which provides a specific temperature estimation for integrated power modules. Unlike the conventional two-resistor compact model, two case nodes are introduced into the proposed model to reflect the temperatures of junction and inductor. Multiple heat sources are also included in the model. FEA simulation is applied to evaluate the thermal model and verify that the accuracy of junction temperature estimation is significantly improved. It is noted that reducing thermal resistance between the junction and IC top case node can significantly enhance the cooling performance, which enables flexible methods to modify the thermal performance.

AB - This paper proposes a new analytical thermal resistance model which provides a specific temperature estimation for integrated power modules. Unlike the conventional two-resistor compact model, two case nodes are introduced into the proposed model to reflect the temperatures of junction and inductor. Multiple heat sources are also included in the model. FEA simulation is applied to evaluate the thermal model and verify that the accuracy of junction temperature estimation is significantly improved. It is noted that reducing thermal resistance between the junction and IC top case node can significantly enhance the cooling performance, which enables flexible methods to modify the thermal performance.

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T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

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BT - 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017

Y2 - 26 March 2017 through 30 March 2017

ER -

Liu W, Liu YF, Wang L, Malcolm D. A novel equivalent circuit thermal model for integrated power modules. In 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 3106-3113. 7931141. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). doi: 10.1109/APEC.2017.7931141

A novel equivalent circuit thermal model for integrated power modules

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