A miniaturized Rogowski current transducer with wide bandwidth and fast response

The miniaturization of the 3D Rogowski current transducer down to the micro-scale is essential for device integration and expansion of its application scope, particularly for 'lab-on-a-chip' systems. However, fabrication of 3D miniaturized Rogowski coils remains challenging as most relative methods still rely on the 2D micromachining process. In this paper, a miniaturized Rogowski coil current transducer was fabricated using an improved femtosecond laser wet etching technology and a metal microsolidification process, in which a metal alloy with a relatively high melting point was used and a robust but simple packaging structure based on a conical electrode was developed. The results show that the miniaturized Rogowski coil current transducer reveals a response time of less than 1 ns, high sensitivity and good detection capability for high-frequency electrical signals. The miniaturized Rogowski coil can easily be integrated into functional microsystems and will be widely applicable for high-frequency electric signal detection and circuit protection.