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A Medium-Voltage Multilevel Hybrid Converter Using 3.3kV Silicon Carbide MOSFETs and Silicon IGBT Modules

  • Fei Diao
  • , Pengyu Lai
  • , Feng Guo
  • , Xinyuan Du
  • , Peng Sun
  • , Yue Zhao
  • , Zhong Chen
  • , Yufei Li
  • University of Arkansas, Fayetteville
  • North China Electric Power University
  • Princeton University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

In this work, a medium voltage (MV) five-level (5-L) hybrid active neutral-point-clamped (ANPC) converter with the inner-interleaved configuration is proposed featuring improved output quality and ease of filtering design. The proposed hybrid ANPC converter consists of the silicon (Si) IGBT based low switching frequency cells and the silicon carbide (SiC) MOSFETs based high switching frequency cells to achieve low harmonics at premium efficiency and reasonable cost. By adopting the inner-interleaved configuration within SiC high switching frequency cell, the proposed hybrid ANPC has increased voltage levels and much higher equivalent switching frequency compared to the conventional ANPC. To validate the effectiveness of the proposed design, an MV converter is prototyped in this work using 3.3 kV Si IGBT half-bridge modules and custom designed compact 3.3 kV SiC H-bridge modules. The design process of the low inductance SiC H-bridge module is also presented. Finally, both simulation and experimental results are presented to validate the performance of the proposed five-level hybrid ANPC converter.

Original languageEnglish
Title of host publicationAPEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages848-853
Number of pages6
ISBN (Electronic)9781665475396
DOIs
StatePublished - 2023
Externally publishedYes
Event38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023 - Orlando, United States
Duration: 19 Mar 202323 Mar 2023

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
Volume2023-March

Conference

Conference38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023
Country/TerritoryUnited States
CityOrlando
Period19/03/2323/03/23

Keywords

  • Hybrid multilevel converter
  • interleave
  • medium-voltage
  • silicon carbide

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