TY - GEN
T1 - A High accuracy resonant pressure sensor with lateral driven and piezoresistive detection
AU - Han, Xiangguang
AU - Zhao, Libo
AU - Li, Xuejiao
AU - Yang, Ping
AU - Wang, Hongyan
AU - Jiang, Zhuangde
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/4
Y1 - 2019/4
N2 - A novel structure of resonant pressure sensor with integrated comb is presented with the electrostatic drive and piezoresistive detection. This design realizes double symmetric 'H' beams assembled in one pressure diaphragm to realize symmetric-lateral vibration. When a pressure applied, the Z-direction offset between fixed and movable combs is less than 0.2 μm, which is beneficial for close-loop control. The novel structure combined with piezoresistive detection and coupling beam is presented, which can obtain pure tensile stress or compressive stress on the detection beam with low noise, adjacent modal output will be easy to filter. The simulated sensor non-linearity after polynomial fitting is less than 0.01%FS with the pressure range of 0-300 kPa, and its measuring sensitivity is up to-25 Hz/kPa.
AB - A novel structure of resonant pressure sensor with integrated comb is presented with the electrostatic drive and piezoresistive detection. This design realizes double symmetric 'H' beams assembled in one pressure diaphragm to realize symmetric-lateral vibration. When a pressure applied, the Z-direction offset between fixed and movable combs is less than 0.2 μm, which is beneficial for close-loop control. The novel structure combined with piezoresistive detection and coupling beam is presented, which can obtain pure tensile stress or compressive stress on the detection beam with low noise, adjacent modal output will be easy to filter. The simulated sensor non-linearity after polynomial fitting is less than 0.01%FS with the pressure range of 0-300 kPa, and its measuring sensitivity is up to-25 Hz/kPa.
KW - high accuracy
KW - integrated comb
KW - lateral driven
KW - piezoresistive detection
KW - resonant pressure sensor
UR - https://www.scopus.com/pages/publications/85076672195
U2 - 10.1109/NEMS.2019.8915599
DO - 10.1109/NEMS.2019.8915599
M3 - 会议稿件
AN - SCOPUS:85076672195
T3 - Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
SP - 167
EP - 171
BT - Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
Y2 - 11 April 2019 through 14 April 2019
ER -