A formation mechanism for ultra-thin nanotwins in highly textured Cu/Ni multilayers

Y. Liu; D. Bufford; S. Rios; H. Wang; J. Chen; J. Y. Zhang; X. Zhang

doi:10.1063/1.3702461

A formation mechanism for ultra-thin nanotwins in highly textured Cu/Ni multilayers

Y. Liu
, D. Bufford
, S. Rios
, H. Wang
, J. Chen
, J. Y. Zhang
, X. Zhang

School of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

46 Scopus citations

Abstract

High density nanotwins with average twin thickness varying from 3 to 6 nm are formed in sputtered highly (111) textured Cu/Ni multilayers, when individual layer thickness is 25 nm or less. Twin interfaces are normal to growth direction. Both maximum twin thickness and volume fraction of twins vary with the individual layer thickness. Coherency stress plays an important role in tailoring the formation of nanotwins. Nanotwins compete with misfit dislocations in accommodating elastic strain energy in epitaxial Cu/Ni multilayers.

Original language	English
Article number	073526
Journal	Journal of Applied Physics
Volume	111
Issue number	7
DOIs	https://doi.org/10.1063/1.3702461
State	Published - 1 Apr 2012

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abstract = "High density nanotwins with average twin thickness varying from 3 to 6 nm are formed in sputtered highly (111) textured Cu/Ni multilayers, when individual layer thickness is 25 nm or less. Twin interfaces are normal to growth direction. Both maximum twin thickness and volume fraction of twins vary with the individual layer thickness. Coherency stress plays an important role in tailoring the formation of nanotwins. Nanotwins compete with misfit dislocations in accommodating elastic strain energy in epitaxial Cu/Ni multilayers.",

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AU - Zhang, X.

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A formation mechanism for ultra-thin nanotwins in highly textured Cu/Ni multilayers

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