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A Double-Sided Cooling 650V/30A GaN Power Module with Low Parasitic Inductance

  • Xi'an Jiaotong University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

26 Scopus citations

Abstract

This paper presents a compact double-sided cooling Gallium Nitride (GaN) power module with low parasitic parameters. The GaN bare dies are sandwiched between two ceramic substrates with high thermal conductivity to achieve efficient double-sided cooling capability. Through careful design and layout optimization, the bus decoupling capacitors and core drive components are successfully integrated into the module to reduce critical parasitic parameters. The thermal and parasitic characteristics of the module are analyzed and optimized. Finally, a double-pulse-test platform is built based on the presented 650V/30A GaN power module. The results show that the power loop inductance is reduced to 0.95 nH and the gate loop inductance is reduced to about 2nH. The dv/dt of the drain-source voltage can be as high as 150V/ns, while the overshoot is only 10%.

Original languageEnglish
Title of host publicationAPEC 2020 - 35th Annual IEEE Applied Power Electronics Conference and Exposition
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2772-2776
Number of pages5
ISBN (Electronic)9781728148298
DOIs
StatePublished - Mar 2020
Event35th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2020 - New Orleans, United States
Duration: 15 Mar 202019 Mar 2020

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
Volume2020-March

Conference

Conference35th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2020
Country/TerritoryUnited States
CityNew Orleans
Period15/03/2019/03/20

Keywords

  • Gallium Nitride (GaN)
  • double-sided cooling
  • parasitic
  • power module

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