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A Cosine-Weighted Interactive Enhancement Network for Wafer Map Defect Recognition with a Pretrain-Finetune Strategy

  • Shulong Gu
  • , Zihao Lei
  • , Di Zhao
  • , Rui Feng
  • , Yu Su
  • , Guangrui Wen
  • Xi'an Jiaotong University
  • East China Institute of Photo-Electron Ic

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Wafer Map Defect Recognition (WMDR) is an essential stage in the semiconductor manufacturing process. It is of great significance to detect and recognize wafer map defects precisely, so as to trace back and locate problems in the manufacturing process and solve them for improving the reliability and productivity of the semiconductor manufacturing process. The current intelligent methods for WMDR are limited in their recognition performance due to their complex structure and lack of effective solutions to the problem of feature weakness of the defects. Therefore, this paper proposes a WMDR model: cosine-weighted interactive enhancement network (CIENet), which is plugged into a cosine-weighted interactive enhancement module (CIEM). CIEM achieves feature enhancement for weak defects by performing an interactive cosine similarity calculation between feature maps and weighing them. Meanwhile, a pretrain-finetune strategy is proposed to train CIENet, which decouples the traditional training process to differentially and purposively optimize CIENet. To verify the effectiveness and superiority of the proposed method, comparative and ablation experiments are conducted on real-world semiconductor wafer datasets. The results show that the proposed model has higher recognition performance than other models, and the proposed pretrain-finetune strategy further improves the recognition performance of the model.

Original languageEnglish
Title of host publicationICSMD 2024 - 5th International Conference on Sensing, Measurement and Data Analytics in the Era of Artificial Intelligence
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331529192
DOIs
StatePublished - 2024
Event5th International Conference on Sensing, Measurement and Data Analytics in the Era of Artificial Intelligence, ICSMD 2024 - Huangshan, China
Duration: 31 Oct 20243 Nov 2024

Publication series

NameICSMD 2024 - 5th International Conference on Sensing, Measurement and Data Analytics in the Era of Artificial Intelligence

Conference

Conference5th International Conference on Sensing, Measurement and Data Analytics in the Era of Artificial Intelligence, ICSMD 2024
Country/TerritoryChina
CityHuangshan
Period31/10/243/11/24

Keywords

  • defect recognition
  • feature enhancement
  • pretrain-finetune strategy
  • wafer map

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