TY - GEN
T1 - A 108.9dB-DR, 2-2 MASH ADC Featuring a Nested Gainboosting FIA with Gm Enhancement in Settling Phase Through Stepwise Charge Sharing
AU - Li, Yuming
AU - Zhang, Lichenxi
AU - Chen, Youxiang
AU - Zhang, Kelei
AU - Pan, Rui
AU - Ji, Junyao
AU - Zhang, Jie
AU - Wang, Xiaofei
AU - Zhang, Hong
N1 - Publisher Copyright:
© 2026 IEEE.
PY - 2026
Y1 - 2026
N2 - This paper presents a 2-2 multistage noise-shaping (MASH) ADC featuring a nested gain-boosting floating inverter amplifier (NGB-FIA) to fulfill the high-gain (>100dB) and low-power requirement. To achieve better utilization of the energy stored on the reservoir capacitor, a stepwise charge sharing scheme is further proposed in the NGB-FIA, which enhances the transconductance (Gm) by 37% during the settling phase of the integrator. Fabricated in a 180-nm CMOS process, the ADC achieves 107.4-dB SNDR and 108.9-dB dynamic range (DR) in a 16-kHz bandwidth while consuming 325.1 μW. This translates into a Schreier figure of merit (FoMS) of 185.8 dB and a FoMSNDR of 184.3 dB.
AB - This paper presents a 2-2 multistage noise-shaping (MASH) ADC featuring a nested gain-boosting floating inverter amplifier (NGB-FIA) to fulfill the high-gain (>100dB) and low-power requirement. To achieve better utilization of the energy stored on the reservoir capacitor, a stepwise charge sharing scheme is further proposed in the NGB-FIA, which enhances the transconductance (Gm) by 37% during the settling phase of the integrator. Fabricated in a 180-nm CMOS process, the ADC achieves 107.4-dB SNDR and 108.9-dB dynamic range (DR) in a 16-kHz bandwidth while consuming 325.1 μW. This translates into a Schreier figure of merit (FoMS) of 185.8 dB and a FoMSNDR of 184.3 dB.
KW - A/D conversion
KW - floating inverter amplifier (FIA)
KW - fully dynamic
KW - multistage noise-shaping
KW - switched capacitor (SC)
UR - https://www.scopus.com/pages/publications/105040980529
U2 - 10.1109/CICC65509.2026.11509552
DO - 10.1109/CICC65509.2026.11509552
M3 - 会议稿件
AN - SCOPUS:105040980529
T3 - Proceedings of the Custom Integrated Circuits Conference
BT - 2026 IEEE Custom Integrated Circuits Conference, CICC 2026 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 46th Annual IEEE Custom Integrated Circuits Conference, CICC 2026
Y2 - 19 April 2026 through 23 April 2026
ER -