3D UV-microreplication using cylindrical PDMS mold

Dongkeon Lee; Harutaka Mekaru; Hiroshi Hiroshima; Sohei Matsumoto; Toshiro Itoh; Masaharu Takahashi; Ryutaro Maeda

doi:10.1007/s00542-009-0969-0

3D UV-microreplication using cylindrical PDMS mold

Dongkeon Lee
, Harutaka Mekaru
, Hiroshi Hiroshima
, Sohei Matsumoto
, Toshiro Itoh
, Masaharu Takahashi
, Ryutaro Maeda

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

This paper reports a novel fabrication method consisting of some procedures such as cylindrical poly-dimethylsiloxane (PDMS) molding, ultraviolet (UV) exposure, Ni electroplating, and dry and wet etching for fabricating a microcoil structure that is expected to be used as a component within a wireless clamp meter to measure the electric power consumption of various information technology (IT) devices for the realization of a green IT society. In comparison with the conventional ultraviolet Lithographie-Gallvanoformung-Abformung (UV-LIGA) process, this method makes it possible to fabricate cylindrical microcomponents at a low-cost, mainly because of using a cheap PDMS mold. By the pre-process of the 3D UV-microreplication method, a UV resin replica pattern was clearly transferred along the surface of the cylindrical metal body within the cavity of the PDMS mold replicated from a master pattern. Ni microcoil structure was fabricated by the post-process, utilizing the UV resin replica pattern as a base for Ni electroplating.

Original language	English
Pages (from-to)	1399-1411
Number of pages	13
Journal	Microsystem Technologies
Volume	16
Issue number	8-9
DOIs	https://doi.org/10.1007/s00542-009-0969-0
State	Published - Aug 2010
Externally published	Yes

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title = "3D UV-microreplication using cylindrical PDMS mold",

abstract = "This paper reports a novel fabrication method consisting of some procedures such as cylindrical poly-dimethylsiloxane (PDMS) molding, ultraviolet (UV) exposure, Ni electroplating, and dry and wet etching for fabricating a microcoil structure that is expected to be used as a component within a wireless clamp meter to measure the electric power consumption of various information technology (IT) devices for the realization of a green IT society. In comparison with the conventional ultraviolet Lithographie-Gallvanoformung-Abformung (UV-LIGA) process, this method makes it possible to fabricate cylindrical microcomponents at a low-cost, mainly because of using a cheap PDMS mold. By the pre-process of the 3D UV-microreplication method, a UV resin replica pattern was clearly transferred along the surface of the cylindrical metal body within the cavity of the PDMS mold replicated from a master pattern. Ni microcoil structure was fabricated by the post-process, utilizing the UV resin replica pattern as a base for Ni electroplating.",

author = "Dongkeon Lee and Harutaka Mekaru and Hiroshi Hiroshima and Sohei Matsumoto and Toshiro Itoh and Masaharu Takahashi and Ryutaro Maeda",

year = "2010",

month = aug,

doi = "10.1007/s00542-009-0969-0",

language = "英语",

volume = "16",

pages = "1399--1411",

journal = "Microsystem Technologies",

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T1 - 3D UV-microreplication using cylindrical PDMS mold

AU - Lee, Dongkeon

AU - Mekaru, Harutaka

AU - Hiroshima, Hiroshi

AU - Matsumoto, Sohei

AU - Itoh, Toshiro

AU - Takahashi, Masaharu

AU - Maeda, Ryutaro

PY - 2010/8

Y1 - 2010/8

N2 - This paper reports a novel fabrication method consisting of some procedures such as cylindrical poly-dimethylsiloxane (PDMS) molding, ultraviolet (UV) exposure, Ni electroplating, and dry and wet etching for fabricating a microcoil structure that is expected to be used as a component within a wireless clamp meter to measure the electric power consumption of various information technology (IT) devices for the realization of a green IT society. In comparison with the conventional ultraviolet Lithographie-Gallvanoformung-Abformung (UV-LIGA) process, this method makes it possible to fabricate cylindrical microcomponents at a low-cost, mainly because of using a cheap PDMS mold. By the pre-process of the 3D UV-microreplication method, a UV resin replica pattern was clearly transferred along the surface of the cylindrical metal body within the cavity of the PDMS mold replicated from a master pattern. Ni microcoil structure was fabricated by the post-process, utilizing the UV resin replica pattern as a base for Ni electroplating.

AB - This paper reports a novel fabrication method consisting of some procedures such as cylindrical poly-dimethylsiloxane (PDMS) molding, ultraviolet (UV) exposure, Ni electroplating, and dry and wet etching for fabricating a microcoil structure that is expected to be used as a component within a wireless clamp meter to measure the electric power consumption of various information technology (IT) devices for the realization of a green IT society. In comparison with the conventional ultraviolet Lithographie-Gallvanoformung-Abformung (UV-LIGA) process, this method makes it possible to fabricate cylindrical microcomponents at a low-cost, mainly because of using a cheap PDMS mold. By the pre-process of the 3D UV-microreplication method, a UV resin replica pattern was clearly transferred along the surface of the cylindrical metal body within the cavity of the PDMS mold replicated from a master pattern. Ni microcoil structure was fabricated by the post-process, utilizing the UV resin replica pattern as a base for Ni electroplating.

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DO - 10.1007/s00542-009-0969-0

M3 - 文章

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SN - 0946-7076

VL - 16

SP - 1399

EP - 1411

JO - Microsystem Technologies

JF - Microsystem Technologies

IS - 8-9

ER -

3D UV-microreplication using cylindrical PDMS mold

Abstract

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