3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics

Highlights A high-precision manufacturing pathway, based on femtosecond laser direct writing, is proposed that can yield liquid metal-based multilayer high-density interconnect soft electronics in a programmable, high-efficiency, and low-cost manner. The high-resolution embedded LM microchannels and high-density VIAs can be fabricated by femtosecond laser direct writing in a maskless manner. The supermetalphobicity induced during laser ablation contributes to successful injection of LM to form high-aspect-ratio blind/through liquid metal microstructures inside the elastomer. The cross-scale multi-layer flexible electronic devices can be realized.