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直流燃弧下铜钨表界面SF6腐蚀机理研究

Translated title of the contribution: Investigation on the corrosion mechanism of W/Cu surfaces and interfaces induced by SF6 under DC arc discharge
  • Xin Wei Zhang
  • , Huai Wang
  • , Hong Yu Zhang
  • , Sheng Chun Yang
  • , Zhi Mao Yang
  • , Chun Cai Kong
  • Xi'an Jiaotong University
  • State Power Investment Corporation Limited

Research output: Contribution to journalArticlepeer-review

Abstract

With the advancement of flexible direct current (DC) transmission technology, high-voltage DC circuit breakers demand higher arc erosion resistance and arc-extinguishing gas corrosion resistance. Copper-tungsten materials are widely employed as contact materials for their exceptional comprehensive properties, and their performance directly affects the operational safety of gas-insulated circuit breaker systems. In this study, first-principles calculations were used to investigate the SF6-induced corrosion behavior of different W/Cu surface and interface structures under DC conditions. Results show that the work function of W/Cu is structure-dependent, with the lowest value (4.28 eV) at the copper-tungsten grain boundary. SF6 adsorbs more strongly on the W phase (adsorption energy: −1.17 eV), while the lowest adsorption energy (−5.80 eV) occurs at the copper-tungsten grain boundary; notably, anodic and cathodic environments significantly affect the adsorption and corrosion processes. After corrosion, both the work function and maximum stress of copper-tungsten decreased by 7%. This study offers theoretical support for designing high-performance copper-tungsten contact materials for high-voltage DC circuit breakers.

Translated title of the contributionInvestigation on the corrosion mechanism of W/Cu surfaces and interfaces induced by SF6 under DC arc discharge
Original languageChinese (Traditional)
Article number240020
JournalScientia Sinica: Physica, Mechanica et Astronomica
Volume56
Issue number4
DOIs
StatePublished - 1 Apr 2026

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