Abstract
This study aims to fill the analysis gap regarding the curing process of new resin made from epoxy resin alcoholysis products. Initially, a non-isothermal differential scanning calorimetry method is employed to investigate the influence of alcoholysis product content on the curing behavior of the re-prepared resin. Subsequently, the curing conditions for the re-prepared resin are determined using a curing kinetics model. A new resin is synthesized accordingly, with its dielectric properties measured. The results indicate that substituting 25% bisphcnol A diglycidyl ether with alcoholysis products leads to a prc-curing temperature of the re-prepared resin below 120 °C and a final curing temperature of 160. 57 °C. This is attributed to that the hydroxyl groups in the alcoholysis products facilitate the ring-opening reaction of epoxy groups. Consequently, as the alcoholysis products increase, the curing temperature of the re-prepared resin decreases. The rc-prcpared resin conforms to a self-catalytic dual-parameter curing kinetics model, with a total reaction order exceeding 1. The apparent activation energy ER during the curing process is a function of the curing degree a, and the actual curing degree of the samples obtained from the E„ (a) function closely matches theoretical values. Compared to the original epoxy resin, the re-prepared resin exhibits an increase in relative dielectric constant, dielectric loss, and breakdown strength, demonstrating the dielectric performance meeting the requirements for epoxy resins employed in power systems. This study offers valuable insights and guidance to the curing process of epoxy resin re-prepared from alcoholysis recovery.
| Translated title of the contribution | Research on Alcoholysis Recovery, Re-Preparation, and Curing Kinetics of Epoxy Resin |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 94-104 |
| Number of pages | 11 |
| Journal | Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University |
| Volume | 58 |
| Issue number | 7 |
| DOIs | |
| State | Published - Jul 2024 |