流体域内热量传递过程的导热-对流并联热阻分析方法

The thermoelectric analogy method and thermal resistance are widely used to solve heat transfer problems to simplify the analysis process of complex heat transfer networks. Traditional thermal resistance is usually applicable to one-dimensional steady-state heat conduction problems. However, heat convection is always involved in engineering applications, such as energy power, petrochemicals, and aerospace. To solve this problem, the concepts of multidimensional thermal conduction-advection parallel resistance analysis in the fluid domain and overall thermal resistance are proposed in this study, and a thermal resistance network is constructed. The area-averaged advection thermal resistance in the fluid domain is closely related to the magnitude and direction of the temperature gradient and velocity. The higher the velocity is, the smaller the area-averaged advection thermal resistance. Simultaneously, “negative thermal resistance” exists in the area-averaged advection thermal resistance, which is equivalent to a “heat source” or “heat sink” in the fluid domain. Results showed that the thermal conduction-advection parallel resistance network plays an important role in the analysis of the flow and heat transfer process and in guiding the regulation and optimization of the heat transfer process.