微纳系统微区感应加热技术的研究进展

Dezhi Wu; Zhuo Chen; Zhenyin Hai; Liang Chen; Kun Ye; Lingyun Wang; Libo Zhao

doi:10.3969/j.issn.1004-132X.2022.01.001

微纳系统微区感应加热技术的研究进展

Translated title of the contribution: Research Progresses of Micro-area Induction Heating Technology in Micro/Nano Systems

Dezhi Wu
, Zhuo Chen
, Zhenyin Hai
, Liang Chen
, Kun Ye
, Lingyun Wang
, Libo Zhao

School of Instrument Science and Technology

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

Micro-area induction heating(MIH), as a localized heating technique with characteristics of non-contact, controllable, and fast thermal-response, was shown numerous potentials in microsystems, such as microelectromechanical systems and microfluidic chips. The fundamentals of MIH were introduced herein, and the research progresses of MIH in the fields of packaging, driving, material growth, et al, was presented systematically. Furthermore, some existing technique problems needed to be solved were analyzed, and several prospective research directions of MIH were pointed out.

Translated title of the contribution	Research Progresses of Micro-area Induction Heating Technology in Micro/Nano Systems
Original language	Chinese (Traditional)
Pages (from-to)	2-14 and 23
Journal	Zhongguo Jixie Gongcheng/China Mechanical Engineering
Volume	33
Issue number	1
DOIs	https://doi.org/10.3969/j.issn.1004-132X.2022.01.001
State	Published - 10 Jan 2022

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10.3969/j.issn.1004-132X.2022.01.001

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title = "微纳系统微区感应加热技术的研究进展",

abstract = "Micro-area induction heating(MIH), as a localized heating technique with characteristics of non-contact, controllable, and fast thermal-response, was shown numerous potentials in microsystems, such as microelectromechanical systems and microfluidic chips. The fundamentals of MIH were introduced herein, and the research progresses of MIH in the fields of packaging, driving, material growth, et al, was presented systematically. Furthermore, some existing technique problems needed to be solved were analyzed, and several prospective research directions of MIH were pointed out.",

keywords = "Induction heating, Localized heating, Microsystem, Packaging",

author = "Dezhi Wu and Zhuo Chen and Zhenyin Hai and Liang Chen and Kun Ye and Lingyun Wang and Libo Zhao",

year = "2022",

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doi = "10.3969/j.issn.1004-132X.2022.01.001",

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T1 - 微纳系统微区感应加热技术的研究进展

AU - Wu, Dezhi

AU - Chen, Zhuo

AU - Hai, Zhenyin

AU - Chen, Liang

AU - Ye, Kun

AU - Wang, Lingyun

AU - Zhao, Libo

PY - 2022/1/10

Y1 - 2022/1/10

N2 - Micro-area induction heating(MIH), as a localized heating technique with characteristics of non-contact, controllable, and fast thermal-response, was shown numerous potentials in microsystems, such as microelectromechanical systems and microfluidic chips. The fundamentals of MIH were introduced herein, and the research progresses of MIH in the fields of packaging, driving, material growth, et al, was presented systematically. Furthermore, some existing technique problems needed to be solved were analyzed, and several prospective research directions of MIH were pointed out.

AB - Micro-area induction heating(MIH), as a localized heating technique with characteristics of non-contact, controllable, and fast thermal-response, was shown numerous potentials in microsystems, such as microelectromechanical systems and microfluidic chips. The fundamentals of MIH were introduced herein, and the research progresses of MIH in the fields of packaging, driving, material growth, et al, was presented systematically. Furthermore, some existing technique problems needed to be solved were analyzed, and several prospective research directions of MIH were pointed out.

KW - Induction heating

KW - Localized heating

KW - Microsystem

KW - Packaging

UR - https://www.scopus.com/pages/publications/85123045691

U2 - 10.3969/j.issn.1004-132X.2022.01.001

DO - 10.3969/j.issn.1004-132X.2022.01.001

M3 - 文章

AN - SCOPUS:85123045691

SN - 1004-132X

VL - 33

SP - 2-14 and 23

JO - Zhongguo Jixie Gongcheng/China Mechanical Engineering

JF - Zhongguo Jixie Gongcheng/China Mechanical Engineering

IS - 1

ER -

微纳系统微区感应加热技术的研究进展

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