功率器件热界面材料研究进展

With the rapid development in miniaturization and integration of power devices, the power density has increased significantly and put forward higher requirements for advanced heat transfer technology. Thermal interface materials play an important role in the thermal management of power devices, which can fill the gas gaps between solid interfaces and reduce the interface contact thermal resistance. This article reviewed the research progress of thermal interface materials in recent years, including single composite thermal interface materials, polymer-based composite thermal interface materials and metal-based thermal interface materials. Besides, the mechanisms and effects of heat transfer enhancement of various thermal interface materials were discussed.Finally, the problems faced in the development of thermal interface materials were summarized, and future research directions were prospected.