Abstract
The robust interface between conductive patterns (metal/non-metal) and the underlying flexible substrates plays a key role in the durability and stability of flexible conductive electrodes. Numerous surface modification techniques have been developed in the past years to realize the interfacial enhancement. However, the existing techniques suffer from different kinds of drawbacks such as requirement for chemical specificity between interfacial modifiers and surfaces, the use of complex instrumentation, the need for multistep procedures for implementation or lack of long-term stability. Here we adopt the dopamine-based polymer as the coating agent to prepare various flexible conductive circuits with unique anti-bending and anti-scratch properties. The polymer coating can effectively coat and modify the wettability of various flexible substrates like PET, PI and PDMS. By quantifying the adhesion betwen the polymer coating on these substrates, we find that it can effectively increse the adhesion between different conductive inks and flexible substrates by several times. Therefore, the polymer coating can not only be successfully introudced to flexible conductive Ag and carbon-based patterns via screen-printing, but also construct flexible Au electrodes via transfer printing. In this way, we are able to fabricate robust flexible electrodes which can undergo thousands cycles of bending and severe scratch. Our study clearly demonstrated that the dopamine-based polymer can be a versatile platform for robust flexible electonics. We believe that our work has combined the easy dopamine chemistry with the burgeoning field of flexible electronics, which could promote the further development of flexible electrodes.
| Translated title of the contribution | A bioinspired surface coating approach for enhancing adhesion and scratch resistance in screen printed flexible circuits |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 1131-1140 |
| Number of pages | 10 |
| Journal | Scientia Sinica Chimica |
| Volume | 48 |
| Issue number | 9 |
| DOIs | |
| State | Published - 2018 |
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